Aylesbury, Buckinghamshire, UK — October 2017 — Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces plans to exhibit at the 14th annual International Wafer-Level Packaging Conference (IWLPC) Expo, scheduled to take place Oct. 24-26, 2017 in San Jose, CA.

Chelmsford, Essex, UK – 11 October 2017 – Pillarhouse International today announced: Over recent years there has been a big push to try and remove wave soldering from the through -hole assembly process. This is not always possible.

Bannockburn, Ill., USA, October 11, 2017 — IPC — Association Connecting Electronics Industries® announces the addition of Nate Carson as director of business development to its staff at IPC headquarters in Bannockburn (Chicago), Ill.

Somerset, NJ – October 11th, 2017 – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be exhibiting its latest range of product solutions, alongside its sister company MacDermid Enthone Electronics Solutions, at the productronica exhibition in Munich, Germany from Tuesday 14th – Friday 17th November.