Circuits Assembly Online Magazine - Current

Press Releases

OSAKA, JAPAN — April 2018 — Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Stand 2L31 at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase the new SN100CVTM P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.

SMTA Europe
Electronics in Harsh Environments Conference
Amsterdam, Netherlands
April 24, 25 & 26, 2018

CYPRESS, CA ― April 2018 ― Metcal has appointed REStronics Northland to provide sales, service and support for its customers in Minnesota and the Upper Midwest.

MADISON, AL — April 2018 — STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and small- to medium-volume contract PCB assembly, is pleased to announce the hiring of Patsy Saint as Technical Instructor.

[30/03/2018 – Taipei, Taiwan] Test Research, Inc. (TRI) proudly announces the launch of its fourth biennial Global Partner Conference, which will host representatives of more than thirty TRI worldwide partners and distributors at TRI's headquarters and manufacturing center in Taipei, Taiwan on April 19-21, 2018.

NORTH BILLERICA, Mass., March 2018 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase the Profile Guardian Redundant Process Monitor and PYRAMAX™ 125N Reflow Oven in Stand 1F25.