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Press Releases

Minneapolis, Minnesota, February 7, 2018 – ITW EAE announces a new partnership agreement with ProSMT Istanbul Turkey to represent and distribute ITW EAE equipment throughout Turkey. The agreement became effective in February 2018.

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Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, today announced plans to exhibit in Booth #3525 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca.

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Täby, 7 February, 2018 - Mycronic AB (publ), has received an order for several systems of the MYPro series from a large Taiwanese contract manufacturer of electronics.

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TAMPA, Fla.--(BUSINESS WIRE)--Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc. (Nasdaq/GM: SYPR), announced today that it has recently received contract awards to manufacture a variety of mission-critical electronic assemblies for a number of global undersea communication projects.

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Chester, Connecticut, USA – Ascentech, LLC will exhibit and highlight INSPECTIS AB’s range of reliable, cost-effective high-definition camera microscopes, as well as GEN3 Systems’ Gensonic Stencil Cleaner and AutoSIR2™ test system (surface insulation test system) at APEX 2018 in San Diego this month in booth #3516.

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East Pittsburgh, Pa., February 7, 2018 – Intervala, LLC, a full-service manufacturer of high-reliability, precision electronic and electromechanical products, announced today that it has implemented Valor® DFM software, expanding its capability offering to include comprehensive DFM (design-for-manufacturing) analysis for complex circuit card assemblies.

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