Rosenheim (Germany), March 2018: Multitest has been the market leader for MEMS/sensor test and calibration equipment for more than 15 years. Multitest has now launched the next generation of its 6DOF gyro test module for singulated packages, which provides significant production benefits resulting in even lower cost of test, enhanced test accuracy and higher daily output.

Milwaukee, WI – Milwaukee Electronics Company, today announced that Rick McClain had been promoted to president. McClain has served as the Company’s chief operating officer (COO) since 2016. P. Michael Stoehr, who previously served as president and chief executive officer (CEO), will continue as CEO.

Irvine, California, USA – TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.

Master Bond is pleased to announce that the following epoxy compounds, EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT and Supreme 12AOHT-LO have passed MIL-STD-883J section 3.5.2., the subsection of the United States Military Standards set by the U.S. Department of Defense that refers to the thermal stability of a material.