Martin Anselm, assistant professor of manufacturing and mechanical engineering technology, was recently named interim director of the Center for Electronics Manufacturing and Assembly at Rochester Institute of Technology. He will assume the leadership role immediately and will lead the training and research operations for the center that focuses on services in semiconductor chip packaging, printed circuit board assemblies and electronics/optoelectronics systems for the electronics packaging industry.

“Within a short period of time at RIT, Martin has successfully established a scholarship portfolio, securing grant funding from numerous organizations including Intel, Universal Instruments, AIM-Photonics and the Department of Labor,” said Manian Ramkumar, interim dean of RIT’s College of Applied Science and Technology. “He has numerous contacts within the electronics industry and is currently negotiating with Intel to secure equipment donation to enhance CEMA.”

Anselm joined RIT’s College of Applied Science and Technology in 2014. His expertise is in electronics failure analysis and root cause analysis, and his research interests include solder joint reliability and advanced manufacturing process development for electronic assemblies. This past summer, Anselm was part of the team that coordinated and presented an advanced manufacturing workforce training for veterans and displaced workers. The training provided occupational skills for the in-demand fields of next-generation manufacturing and technology, optics, photonics and imaging, and electronics assembly in New York state, and part of the long-term strategic planning set forth through the state’s Regional Economic Development Councils.

Prior to coming to RIT, Anselm worked for 15 years at Universal Instruments as a process engineer, manager of the company’s failure analysis services and coordinator of research projects for the company’s Advanced Processing Laboratory. He has held leadership positions with the Surface Mount Technology Association, including training committee chair and on the association’s board of directors.

CEMA offers training and development in electronics packaging as well as undergraduate and graduate degree programs. Faculty and technical associates of the center also customized seminars, in-field training and distance learning. Participants have access to state-of-the-art facilities capable of producing prototype assemblies and providing board design, manufacturing, inspection, testing and rework services.

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