Products
Flat Fan Rinsing Nozzles, manufactured primarily from polypropylene or PVDF (stainless steel is also available), are engineered for final rinses and come in “water saver” models as low as 0.2gpm.
032 general purpose, no-clean, halogen-free flux-cored solder wire is said to reduces spatter compared with conventional cored wire.
WP616 zero-halogen, Pb-free, water-soluble solder paste is for nitrogen and air reflow applications.
ChipVORX and VarioTAP embedded board test technologies now support Intel Arria 10 SoC (system-on-chip).
Master Bond EP110F8-3 is a two-part epoxy for sealing, encapsulating, potting, and casting applications.
CA-188-1 low-temperature cure electrically conductive adhesive is for die attach and general circuit assembly applications.
Press Releases
- Trilogy-NET Adds Second Vapor Phase Reflow System to Expand High-Precision Manufacturing
- Federal Electronics Invests in HydroJet Inline Cleaning Technology at Hermosillo Facility
- Seika Machinery to Host Webinar on Wireless Strain Measurement for PCB Testing
- NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities