Shenmao Technology's SMF-WC58 is a halogen-free, water-soluble tacky flux. Engineered for ultra-fine bump pitch flip-chip and BGA/CSP processes. Designed for advanced semiconductor packaging. Delivers wettability on a broad range of pad finishes, including Bare Cu, Cu-OSP, NiAu, ENEPIG and ImSn. Offers a work life of 12 hours or more. After reflow, residues are removed using deionized water. Compatible with printing, transfer and dipping applications.

Data I/O FlashCORE III-M4 universal manual programmer is built on the FlashCORE III programming engine. Has read/write speeds greater than 10MBytes per second (80Mbits/s) for capable devices. Fast downloads over 100 Base-T Ethernet connection. Configurable FPGA for optimized programming now and in future.

Data I/O LumenX-M8 manual programmer supports applications transitioning from eMMC Flash memory to universal flash storage (UFS). Is designed for programming performance during the design/NPI process.

Asscon VP 2200 vapor phase reflow system comes in single- or dual-lane inline configuration and with or without vacuum, for faster reflow processing and greater flexibility. Replaces four previous inline systems with one fully retrofittable solution. While in dual-lane mode, accepts boards from single-lane upstream production and uses a modular shuttle to double throughput. Novel permanent filter system is said to reduce Galden filter change time by 90%. Filters are positioned inside cooling zone without a housing, and the simplified design maintains full effectiveness while halving the number of parts. Enhanced flux management improves operational uptime. Software platform and HMI are intuitive and offer consistent programming across batch and inline systems.