Products
Master Bond UV15-7HP low viscosity, easy to apply, one-part, UV curable adhesive cures rapidly with a minimum intensity of 20-40mW/cm2 using a UV light source emitting at a wavelength of 320-365nm.
Count On Tools (COT) gripper technology designed for ASM surface mount machines enables component handling ranging from 2.0-6.0mm.
Shenmao PF606-P lead-free solder paste for use in "reverse hybrid" board assembly is compatible with existing SAC SMT materials and reflow processes.
Vishay LTO 150H resistor handles higher pulse energy for protection in high-stress environments. Absorbs up to 75J/0.1s and dissipates 150W at 45°C, with low thermal resistance for stability. Supports resistance values from 1Ω to 2.2 kΩ and operates at up to 175°C in EV, industrial, and telecom systems.Page Break
Vishay Intertechnology, Inc.
CE3S Millice StripAid X series biodegradable solvent removes WaferGrip and TrueGrip adhesives. Suitable for wafer thinning, ultrasonic agitation, and high-temperature debonding. Enables safer, cleaner semiconductor processes with simplified storage.Page Break
CE3S
Saki Corp. 3Xi-M200 AXI now has upgraded software that improves solder joint defect detection for power modules, including those with thick baseplates and heat-dissipating finned structures.
Press Releases
- NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Nordson Test & Inspection Expands Partnership with Distributor smartTec Nordic A/S