ASMPT has launched the Siplace Placement Platform, a newly developed SMT solution engineered to deliver up to 30% higher productivity for automotive, IT and network infrastructure sectors. The platform offers floor space performance while maintaining compatibility with existing feeders and SIPLACE software. It fits into ASMPT’s intelligent factory framework to support scalable, high-volume electronics manufacturing.

ASMPT has introduced the DEK Oversized Solder Paste Printer, engineered to meet the demands of advanced applications in AI and high-performance computing. Optimized for oversized circuit boards. This platform is designed to support the next generation of high-density assemblies and integrates with intelligent factory software for automated production environments.

ITW EAE Vitronics Soltec Centurion reflow oven with CoolClean improves process reliability by removing contaminated gases from the cool zone, reducing flux residue, and extending maintenance intervals.

ITW EAE Electrovert EcoWave wave soldering system integrates two patented technologies to improve hole fill, reduce bridging defects and lower dross production.