Products
Würth Elektronik's portfolio of digital isolators now features a two-channel version in a SOIC 8WB package (5.85 x 11.5 x 2.8 mm).
Indium's PicoShot NC-6M is a no-clean, halogen-free, Type 6 powder-size material specifically formulated to be compatible with Mycronic jetting systems and Mycronic’s “small dot” ejector.
Aven’s new diagonal cutters are crafted to provide superior cutting capabilities and longevity, making them ideal for a wide range of industrial tasks.
Master Bond's UV15DC80-1Med is a one-component, no-mix epoxy that offers a dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization.
TopLine's new braided solder columns are designed to serve as a drop-in replacement for solder spheres used in BGA components.
Indium's Durafuse HR solder paste alloy is said to deliver enhanced thermal cycling performance and superior voiding performance without vacuum reflow, especially for high-reliability automotive applications.
Press Releases
- Weller Tools Celebrates 80 Years of Innovation with Special Black Edition WE1010 and ZeroSmog Shield; Philippe Buidin Comments
- Saki America, Inc. Appoints Mario Ramírez Galindo as Project Engineer in Mexico; Craig Brown Comments
- BEST Inc to Host Soldering 101 Workshop at Illinois & Michigan Locations
- Incap Corporation: Incap's Annual and Sustainability Report 2024 published