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Continuous Film Calibration option for selective coating applications uniquely senses the entire coating pattern. Rather than move across a sensor seeking the film edges to determine pattern width, it quickly detects the entire film and feedbacks pattern width and any gaps or breaks in the film itself down to the pixel level. Proprietary user interface easily sets desired pattern width. Any variation in width during a routine verification will result in automatic recalibration of the fluid delivery system settings with no required operator intervention. Since the pattern is evaluated in its entirety and does not traverse over a stationary sensor to recalibrate, time and volume of coating required to recover to optimal pattern characteristics are reduced.

PVA (Precision Valve & Automation, Inc.), http://www.pva.net

 

 

CyberGage360 automated 3D scanning system facilitates quality assurance of incoming parts and in-process inspection of components on the manufacturing floor. Is designed for use in general purpose metrology. Applications include consumer electronics and industrial applications from automotive to aerospace. 360-degree automated 3D scan of high-tolerance parts can be generated in less than 3 min. Incorporates 3D multi-reflection suppression (MRS) technology that inhibits measurement distortions. Automatically generates inspection report, including a comparison to a CAD model.

CyberOptics, www.cyberoptics.com

 

PF606-XP LED dipping solder paste has great viscosity characteristics and stable tackiness, exhibiting uniform dipping volume and transfer rate.

Shenmao America, www.shenmao.com

 

PF606-P128 lead-free LED die bonding solder is available for dispensing in syringes in lower viscosity; exhibits excellent slump characteristics, consistent dispense ability, and stable tackiness.

Shenmao America, www.shenmao.com

 

PF606-P116 lead-free LED die bonding solder reportedly offers long stencil printing life, high tackiness (slump resistance), and consistent printability with excellent wetting characteristics for LED die bonding.

Shenmao America, www.shenmao.com

 

Supreme 45HTQ-4 two-component epoxy features silicon carbide filler, for high-performance bonding, sealing, coating and casting. Serviceable from -100° to +450°F, is capable of withstanding rigorous thermal cycling. Tensile lap shear of 1,400-1,600 psi, compressive strength of 24,000-26,000 psi and and tensile strength of 8,000-9,000 psi. Retains strength at elevated temperatures. Is dimensionally stable, with low shrinkage upon curing. Dielectric constant at 60Hz of 4.6 and volume resistivity exceeding 1014 ohm-cm. Mix ratio of 100 to 30 by weight and thixotropic paste consistency. Pot life of more than 12 hr. at room temperature for a 100g batch. Requires oven curing at 250°-300°F with various cure schedules. Bonds to a variety of substrates including metals, composites, ceramics and most plastics. Comes in 0.5 pint to 5gal. kits Shelf life of 6 mo. at ambient temperatures.

Master Bond, masterbond.com

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