EP62-1LPSP optically clear epoxy is for bonding, sealing, coating and encapsulation applications. Has a tensile lap shear strength exceeding 2,000psi. Has a non-critical four-to-one mix ratio by weight and features an open time of 12-24 hrs. at ambient temperatures. Has a thin mixed viscosity of 150-300cps, which can be lowered by adding heat. Low exotherm while curing allows for large encapsulations. Can be cured at temperatures as low as 60-70°C. Faster cures can be achieved at 125°C. Featuring a glass transition temperature of greater than 125°C, it is thermally stable and is serviceable over the temperature range of -60°F to +400°F. Is a reliable electrical insulator and has a volume resistivity over 1014ohm-cm.

Master Bond, www.masterbond.com

535-11M-3 UV-cured epoxy is a low stress, lower glass transition temperature version of 535-10M-1. Is  nonconductive and said to cure rapidly when exposed to high-intensity UV light. Is low outgassing, flexible, and high strength. Contains no antimony. 

Engineered Material Systems, www.conductives.com

Hotflow 3/20 is based on Multijet Ersa heating technology.  Has dual, triple and quad track options. Reportedly can increase throughput by as much as 400% without increasing floor space. Tracks run at own set speed and own printed circuit board width.

Ersa, www.ersa.com

Smartflow 2020 selective soldering system requires less than 3m² of space. Uses same selective soldering technology as Versaflow. Has universal pallet fastening. Can handle printed circuit board sizes up to 508mm x 508mm.

Ersa, www.ersa.com