Products
nForce delivers a turn-key alternative to using shop floor PCs as an interface to the Aegis MOS system. Reportedly ensures an “interlocked” process to eliminate errors; provides users with immediate process fault information.
Aegis Software, www.aiscorp.com
2K Spectro is a high-resolution, high-speed AOI solution. Has a 12-bit color camera. Reportedly collects 8x more information than 8-bit systems. Combines GPU and Core i7 PC; delivers excellent image quality. Incorporates high-intensity, programmable broadband lighting system.
Vi Technology, www.vitechnology.com
2K Spectro is a high-resolution, high-speed AOI solution. Has a 12-bit color camera. Reportedly collects 8x more information than 8-bit systems. Combines GPU and Core i7 PC; delivers excellent image quality. Incorporates high-intensity, programmable broadband lighting system.
Vi Technology, www.vitechnology.com
Cobra Feeder Cart holds up to 90 feeders and reels. Simplifies setup of SMD pick-and-place machines and facilitates feeder handling. Doubles as a feeder storage platform; serves as storage for feeders used for the next job, as well as a repository for feeders disassembled from the pick-and-place machine. All types of Cobra feeders can be mounted, including component reels. Two racks for 45 feeders each are arranged above each other. Has 360° wheels to push cart in any direction. Is delivered as an add-on to Cobra and Paraquda pick-and-place systems.
Essemtec, www.essemtec.com
Cobra Feeder Cart holds up to 90 feeders and reels. Simplifies setup of SMD pick-and-place machines and facilitates feeder handling. Doubles as a feeder storage platform; serves as storage for feeders used for the next job, as well as a repository for feeders disassembled from the pick-and-place machine. All types of Cobra feeders can be mounted, including component reels. Two racks for 45 feeders each are arranged above each other. Has 360° wheels to push cart in any direction. Is delivered as an add-on to Cobra and Paraquda pick-and-place systems.
Essemtec, www.essemtec.com
DE-7826 (dam) and CE-7826 (fill) dam and fill chip encapsulants are for chip-on-board applications. Are designed to protect wire bonds and reduce stresses associated with thermal cycling. Are engineered to withstand circuit board reliability test criteria. Have thermal expansion coefficients in the 20ppm range when measured by thermal mechanical analysis. Have high glass transition temperatures and modulus to retain low expansion properties throughout operating temperature range of the circuit board. Meet standards for ionic cleanliness.
Engineered Material Systems, www.conductives.com
