Products
EO-B-023 A to E series fluxes are identical to EO-FC-006 filling compound used in tubular solders.
Structalit 5705 removable edge bonder is formulated for bonding consumer electronics components.
Critical Manufacturing manufacturing execution system v. 9 uses manufacturing-specific DevOps Center to enable software to be deployed to multiple plants located anywhere.
LineMaster Falcon Plus inline platform combines VisionPro Merlin Detech2 image- and algorithm-based AOI sensor/software technology.
PF735-P267J low melting point lead-free solder paste is designed for jetting. Offers excellent workability and solderability for automatic high-speed jetting production.
Press Releases
- Indium Corporation to Showcase Innovative Electronics Assembly Products at International Symposium on Microelectronics
- Cirtronics Welcomes Patrick Moody as New CEO to Lead Next Era of Growth
- Kurtz Ersa: New Factory Launched in Ciudad Juárez
- Bright Machines Appoints Seasoned Enterprise Technology Executive Chris Stori as CEO to Drive Next Phase of Growth