GTO graphical user interface helps rework and assembly technicians locate single or multiple components on a PCB. Produces a unified PCB image by combining top and bottom Gerber silkscreens, pick-and-place drill files, and formatted BoM (.csv file). Creates a composite view of PCB by fusing silkscreens, parts list, and placement information into a single view, allowing locating an individual component or a group of BoM line-item components. Generates assembly notes, and automatically generates symbol/color coded assembly prints, showing exactly which parts need to be located in certain locations on the PCB. Stored project bundle creates a single file containing top and bottom silkscreen, pick-and-place, BoM, and notes to be distributed to engineering or customers.

Saelig Co., www.saelig.com

XT V 130 x-ray inspection system is compact and comes with a 30-130 kV open micro-focus x-ray source, 4-axis programmable manipulator and 16-bit imaging system based on a 4” image intensifier. Reports compliant with MRP systems. Focal spot size down to 3 microns, 320X geometric magnification and tilt angle up to 60°. Rotate stage and CT capability optional. Hinged door provides access to inspection area, which fits samples up to 40 x 35 cm (16 x 14”).

Nikon Metrology, www.nikonmetrology.com

PowerRepair is for de-soldering and soldering of through-hole components to PCBs. Features mini-wave soldering technology, able de-solder/solder high-pin-count components and connectors. Also handles components with high thermal mass (thick pins, multilayer boards etc.), and is compatible with all Pb-free solder alloys. Soldering nozzle is designed for high energy transfer rate, even in high-temperature applications. Features short repair cycles, and low thermal stress on the PCB and components.  All soldering parameters are programmable.

Seho Systems, www.sehona.com

Multicore DA101 incorporates a no-clean, ROLO flux and is formulated for printing processes. Is said to withstand temperatures of 300°to 330°C for high-Pb reflow profiles and Pb-free temperatures between 240° and 270°C. Wets to copper, NiPdAu and Ag finishes, among others. Exhibits less that 5% void instances on average. Can be cleaned with standard cleaning chemistries.

Henkel, www.henkel.com/electronics