Auto-Dip Pb-free solder dipping is a benchtop, fixtureless system that simulates the action of a wave without dislodging components when boards, retained by a grid of needle supports, are dipped into the solder bath. Solder is then evenly applied while surface tension “floats” the PCBs at the correct through-hole wetting height. Single boards or pallets of up to 19.3" x 12.5" are processed in 2 to 12 sec. Activation is microprocessor-controlled with startup and shutdown times pre-settable for intervals up to one week. Adjusts for dwell time, Pb-free compatible temperatures from 220º to 299º C, and dipping angle. A built-in motorized skimmer removes dross as needed.
The free Intermediate Data Format Plug-In is the first plug-in module for PCB123 based on the v. 3.1 Software Developer’s Kit. Enables import of PCB designs for use in mechanical and electrical CAD systems in a bidirectional, neutral format within the ECOsystem Design Environment. Imports outline definitions of the PCB as specified by the mechanical CAD tool, synchronizing the mechanical design work with the PCB development work.
FLX2010C is for placement of special components on film or flex boards. Features a conveyor system said to permit flexible and fast placement on the substrate. Can be placed upstream in the line before a die bonder. In a downstream pick-and-place process, components reportedly are accurately placed on these dice, where the sandwich carrier will be inserted from the left side and stopped by a "stopin" mechanism. The carrier is located with a chuck. Nozzles suck in from the underside of the sandwich carrier at defined positions. The substrate can be populated from conventional component feeder systems after the alignment of the fiducials. The film leaves the placement machine via the conveyor after the release of the sandwich carrier from the vacuum.
The V3025-B vacuum interrupter assists in precision placement of small parts. The interrupter block controls the vacuum. The hand that holds the vacuum tweezer pen is used to position the part being placed; the other hand taps on the button on the interrupter block to release the part.
The SP003-ML-V stencil printer is for small and medium volumes. Has an integrated vision system. Offers control over squeegee and speed attributes and reportedly can reproduce them securely. Consists of two quick-fix cameras that look directly through the stencil apertures down to the PCB. Images are simultaneously displayed on two 8" monitors to check alignment. Correction of X, Y and theta axes is possible using backlash-free adjusting screws. Comes standard with a universal PCB fixture mechanism. Adjustable magnetic table can accept single- and double-sided substrates. Print area measures up to 360 x 400 mm; screens and stencils can be mounted in frames with up to 23" x 23" in size.
The Agilent U8101A display tester is for custom setups for visual testing of up to five major display formats. Is suitable for testing FPD and CRT displays, and LCD panels in PC and TV manufacturing. Is said to support all major analog and digital interfaces and permits future upgrades. Has multiple plug-in card slots to customize instrument configuration. Uses a 5.7" color LCD display and Windows-based graphical user interface. Can select different display formats, test configurations and other frequently used functions on front panel. Has capability to recall up to 16 test sequences and patterns. USB capable. Agilent Technologies Inc., www.agilent.com