Circuits Assembly Online Magazine - Current

Products

Indium9.32 Die-Attach Solder Paste is a halogen-free, no-clean, die-attach solder paste. Is used in high-volume manufacturing for Pb-free die-attach applications. Is said to exhibit low voiding (<5% total voiding achievable in most instances), as well as ultra-low residue.

Indium, www.indium.com

K7000 circular linear blade depanelizer singulates pre-scored PCBs with tight component spacing. The linear blade is 12" long and has a 0.030" thin symmetrical cutting edge. The circular blade is 3.8" in diameter and has the same cutting edge profile as the linear blade. This blade is mounted on a shaft with the center line passing through the middle of the support bearing. For singulating panels with components such as BGA sockets that encroach on the edge of the board. Unit weighs less than 30 lbs.

FKN Systek, www.Fknsystek.com

An updated Model 5500 Benchtop Stencil Printer reportedly provides vertical separation of the stencil from the PCB prior to the lifting of the stencil frame. Includes tooling for double-sided boards and dual squeegees mounted to linear slide bearings for side-to-side squeegee motion. Includes squeegees with stainless steel blades and rubber blades. Self-locking dial adjustments permit X, Y, Z, and R axis settings. Maximum print area is 500 x 550 mm, and maximum frame size is 600 x 600 mm. Net weight of approximately 165 lbs.

Manncorp, www.manncorp.com

These electrostatic dissipative workstations are certified to meet specific electrical property requirements; said to ensure static dissipation at a safe rate. Pedestals and workbench components can be protected by static dissipative powder-coat finishes available in three standard colors. Feature work surfaces and shelves with static dissipative plastic laminate; have ground bolts with a 12' grounding cord. Can be configured in a variety of heights and lengths, with cabinet pedestals and/or legs.

Lista International Corp., www.listaintl.com

The X3 3-D x-ray system inspects PCBs with BGAs and other hidden solder joints. Gathers multiple oblique images to construct a rendering used in identifying solder and component-related defects on both single and double-sided boards. Selectively uses 2-D or 3-D to inspect specific regions. Permits discrimination between top and bottom sides of boards. A typical inspection program is said to be created in fewer than 45 min. Reportedly is suited for inline or offline applications. Has remote programming and real-time SPC software.

YESTech Inc., www.yestechinc.com

Slic Blade line squeegee blades are said to form a surface with low surface energy. Provide 100% electroformed nickel. Solid electroformed nickel reportedly will not chip or flake. Are said to provide lowest wiping pressure and longest blade life; enhanced stencil life and the least stencil damage. Eliminate solder paste sticking and shearing against the blade.

Fine Line Stencil, www.finelinestencil.com