MicroPILR platform has low-profile, pin-shaped contacts that replace solder balls on semiconductor packages and plated vias in package substrates and PCBs. Benefits reportedly include reduced profile, fine pitch, improved electrical and thermal performance, and enhanced reliability. Pins can be used as internal or external interconnections in a variety of applications, including the interconnection between semiconductor die and package substrates, semiconductor packages and PCBs, the layers within package substrates, and PCBs to PCBs. Can be formed directly onto substrates and are typically nickel/gold plated copper. Range from 25 to 175 microns in height and 40 to 200 microns in pin tip diameter. Is capable of enabling contact pitches to 100 microns in a die-to-package substrate; in package-to-PCB applications, pitches to 0.3 mm or lower; and within package substrates, pitches of 150 microns or lower. Specific device applications include high-density stacked flash, DRAM and SRAM; logic plus memory packaging; and stacked and mobile memory packaging. 
 

The PMT400 rework system is designed for rework of microBGA, BGA, CSP, SMT, MCM and PTH assemblies. Proprietary Windows-based X-PC Advanced Process software provides GUI, featuring intuitive programming and Teach Mode profiling. Is Pb-free capable. Features precision gantry motion and a standard two-zone IR bottom heater. Provides performance in a small 28" sq. footprint. Includes a six-nozzle starter, network data management (XP Pro), real-time thermal control (external TC), automatic retract optics and an automated component pickup nest. Can handle 0.010" minimum component size, and offers a 2" sq. field of view, as well as 2" top- and bottom-side clearance. Provides 1 kW focused convection top heater and 14 x 20" maximum board size with 1.5 kW IR bottom heater.
 
VJ Electronix, www.vjelectronix.com