Products
Elektrobit Group will highlight the Display Tester in booth E1A04 during Nepcon China/EMT China in April. It provides automated testing on in-line or stand-alone test systems, and features software for the testing of small LCD displays, keyboards and housings of electronics equipment. The tester offers display defect detection through an immunity to significant variations in illumination, party orientation and display protection tape.
Features an Easy Test Case generation with GUI and does not require programming. It integrates easily through COM interface. It also supports a range of Firewire (IEEE-1394) and USB 2.0 cameras. Run-time version with calibration features is also available.
Features include unlimited maximum resolution, support for up to 254 cameras, test cases controllable with separate customer-specific applications and image processing in a computer with no extra hardware. No third-party low-level image processing libraries are needed.
Has tools for display location and alignment as well as for pixel defect and contrast identification. It performs the measurements for pattern matching, colour and greyscale illumination and keypad backlight. Inspects the icon presence and measures the keypad distance and size. The calibration tool uses pixel grid or checkerboard pattern method. Focus analysis tool extends usage to camera module testing.
Elektrobit, elektrobit.com
Europlacer will display the Xpress 25 flexible, high-volume SMT placement system in booth 1F01 at the upcoming Nepcon China/EMT China trade show and exhibition.
Claims to bring new vision to modular placement ¾ combining high-speed and fine-pitch capabilities in a compact footprint. Twin heads can place an array of devices from 0201 to 50 x 50 mm QFP (70 x 70 mm QFP and 100 mm connector optional) at a tact time of 0.144 sec. (25,000 cph). Equipped with “smart nozzles” and on-the-fly vision.
Benefits include intelligent feeder technology, “smart” nozzles and more.
Has feeder capacity of 92 x 8 mm and an accuracy of ±0.06 mm (QFP) to ±0.1 mm (chip) at 4 sigma. Features a minimum pitch of 0.4 mm (with an 0.3 mm optional) and a tape size range of 8 to 88 mm.
Available options include: intelligent tape feeders, intelligent tape trolley, intelligent belt feeders, intelligent vibratory feeders, intelligent internal matrix tray, intelligent matrix tray sequencer, passive tape trolley, offline storage trolley, component verification, barcode reader, fixed upward vision camera and software.
Europlacer, europlacer.com
Claims to bring new vision to modular placement ¾ combining high-speed and fine-pitch capabilities in a compact footprint. Twin heads can place an array of devices from 0201 to 50 x 50 mm QFP (70 x 70 mm QFP and 100 mm connector optional) at a tact time of 0.144 sec. (25,000 cph). Equipped with “smart nozzles” and on-the-fly vision.
Benefits include intelligent feeder technology, “smart” nozzles and more.
Has feeder capacity of 92 x 8 mm and an accuracy of ±0.06 mm (QFP) to ±0.1 mm (chip) at 4 sigma. Features a minimum pitch of 0.4 mm (with an 0.3 mm optional) and a tape size range of 8 to 88 mm.
Available options include: intelligent tape feeders, intelligent tape trolley, intelligent belt feeders, intelligent vibratory feeders, intelligent internal matrix tray, intelligent matrix tray sequencer, passive tape trolley, offline storage trolley, component verification, barcode reader, fixed upward vision camera and software.
Europlacer, europlacer.com
At SMT/Hybrid/Packaging on May 30-June 1, in Nuremberg, Germany, GÖPEL will exhibit products for AOI and JTAG/Boundary Scan. Visitors can see the OptiCon AOI platform, the JTAG/Boundary Scan hardware architecture Scanflex and the latest version of the Integrated Boundary Scan Development Environment System Cascon in stand 339, hall 4.
The OptiCon system’s core element is a modularly extendable camera. This camera allows the alternative selection between a one- and four- MegaPixel camera module. For even higher test coverage, the user can install additional camera options for THT components, color inspection or 3-D measurement as well as angled view inspection. The platform is said to offer high test speed, reduced debug times, minimal false call rate and high fault coverage.
The OptiCon system’s core element is a modularly extendable camera. This camera allows the alternative selection between a one- and four- MegaPixel camera module. For even higher test coverage, the user can install additional camera options for THT components, color inspection or 3-D measurement as well as angled view inspection. The platform is said to offer high test speed, reduced debug times, minimal false call rate and high fault coverage.
GÖPEL electronic, goepel.com
SPRINTavi automatic in-line printer accepts the standard 29" (737 mm) stencil frame. Using Speedprint's "look down, look down" vision alignment technology, the printer facilitates "pase on stencil" inspection. The camera ensures 6 sigma repeatability.
Options include 2-D paste inspection, programmable paste dispenser, SPC data collection and tooling options such as a laser-guided tooling system and the Vacunest tooling package.
Designed for flexibility, easy changeover and long-term reliability.
A-Tek, atekllc.com
Options include 2-D paste inspection, programmable paste dispenser, SPC data collection and tooling options such as a laser-guided tooling system and the Vacunest tooling package.
Designed for flexibility, easy changeover and long-term reliability.
A-Tek, atekllc.com
Magnet Wire Stripping Pot strips film insulations from wires of all sizes and configurations. The wires are dipped into the stripping solution to quickly remove the insulation. This stripping method will not cause mechanical stress or abrasion to the conductor. Units are available in two models: DSP1 has basic temperature control and DSP2 has a programmable temperature control for selecting and maintaining an exact temperature. Both are available in 115V 60Hz or 220/240V 50/60Hz. Custom sizes can be quoted.
The Eraser Co. Inc., eraser.com
The Eraser Co. Inc., eraser.com
Finetech will highlight the Fineplacer Pico system in booth E1A02 during Nepcon China/EMT China on April 4-7.
The base module can be used in a wide field of applications for rework and different kinds of micro assembly, e.g. flip chip bonding. For micro assembly, it offers 5 µm (0.2 mil) placement accuracy, allowing die with a pitch down to 50 µm to be bonded. The rework configuration offers accessibility for nearly all large standard surface-mount components.
It is capable of both rework and assembly. It can be configured with a small passive rework application package that includes all rework steps: component removal, residual solder removal, paste dispensing and new component soldering. This configuration makes it possible to see 0201 or 01005 components using high-magnification optics. The optional integrated solder paste dispenser can dispense solder paste dots small enough for 01005 rework and can also be configured to dispense epoxy and underfill.
A second application package is available for mobile device rework. Comes equipped with a motorized placement module and can perform the entire rework process for the smallest of devices up to RF shield cans.
The flip chip bonding configuration includes additional process modules: a chip contact heating module, special heating plate and a bonding force module. Many flip chip applications can be supported, including eutectic and AuSn soldering, thermo compression and thermo/ultrasonic bonding, adhesive technologies, ACP (Anisotropic Conductive Paste), and Chip On Glass (ACF).
Features "WinCOMISS" software that controls bond force during placement and soldering.
Finetech, finetechusa.com
The base module can be used in a wide field of applications for rework and different kinds of micro assembly, e.g. flip chip bonding. For micro assembly, it offers 5 µm (0.2 mil) placement accuracy, allowing die with a pitch down to 50 µm to be bonded. The rework configuration offers accessibility for nearly all large standard surface-mount components.
It is capable of both rework and assembly. It can be configured with a small passive rework application package that includes all rework steps: component removal, residual solder removal, paste dispensing and new component soldering. This configuration makes it possible to see 0201 or 01005 components using high-magnification optics. The optional integrated solder paste dispenser can dispense solder paste dots small enough for 01005 rework and can also be configured to dispense epoxy and underfill.
A second application package is available for mobile device rework. Comes equipped with a motorized placement module and can perform the entire rework process for the smallest of devices up to RF shield cans.
The flip chip bonding configuration includes additional process modules: a chip contact heating module, special heating plate and a bonding force module. Many flip chip applications can be supported, including eutectic and AuSn soldering, thermo compression and thermo/ultrasonic bonding, adhesive technologies, ACP (Anisotropic Conductive Paste), and Chip On Glass (ACF).
Features "WinCOMISS" software that controls bond force during placement and soldering.
Finetech, finetechusa.com
Press Releases
- Absolute EMS Passes AS9100D, ISO 13485:2016, and ISO 9001:2015 Surveillance Audits with Zero Findings; Ray Amirkiai Comments
- Stannol Welcomes James Wertin as Director of Technical Sales and Solutions – North America; Thomas Ruch Comments
- APE, Automated Production Equipment, Marks 56-year Milestone
- Kitron Signs Multi-Year Agreement for Advanced Sensor Manufacturing in Europe; Kristoffer Asklöv Comments