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Accutronic, a flat-belt-driven, powered live-roller accumulation conveyor with 24-volt electric actuation is said to offer quiet, positive transportation and true zero-pressure accumulation of cases, cartons and totes.

 

Reduces noise and removes lubrication requirements associated with chain-and-pad-driven live roller conveyor. 24-volt electric stepper motor lift mechanism eliminates the need for the compressed air, increasing installation flexibility and producing energy savings.

 

Features an automatic sleep mode, which disengages the drive if no product has rolled by in eight seconds, and detectors built into the photo-eye sensors that shut the system down five seconds after sensing a product jam. Photo-eye sensors, factory installed and aligned, and control modules are delivered ready to run.

 

Designed for medium-duty, high-speed accumulation lines. Offers speeds up to 400 ft./min. on transportation and up to 240 ft./min. on accumulation.

Weight capacity is 35 lb./ft. for live loads,  100 lb. per package. Provides release rates of up to 95% and acceptance rates up to 100%.

 

Available in three-, six-, nine- and 12-foot lengths with a standard zone length of three feet. Available widths between frames are 16", 22", 28", 34" and 40".

 

FKI Logistex North America,  fkilogistex.com

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Smart Sonic ultrasonic stencil cleaning process cleans at very low power density (watts/liter) as early research by GEC Marconi and the EMPF Laboratory indicated that lower power density equals higher safety.

 

Recent studies indicate that ultrasonic power densities of 10 watts per liter or less are desirable for the safe cleaning of populated PCBs. These stencil cleaners have always been rated at 10 watts per liter and still clean any type of solder paste from fine-pitch stencils.

 

Cleans all types of solder paste at low power densities due to the cleaning efficiency of their proprietary 440-R SMT Detergent and the mechanical efficiency of the ultrasonic transducers. 

 

Smart Sonic, smartsonic.com


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29 x 29" VectorGuard stencils allow customers to reduce changeover time and ease stencil handling and storage challenges in applications requiring a large image area.

 

The large format foils are available in popular thicknesses, including 0.005" (0.127mm) and 0.006"(0.152mm).

 

Customers can also use the 29 x 29" frameless system in machines that do not have an adjustable chase, including non-DEK machines, or where they prefer not to use side bar extensions. The system then becomes a straight swap for existing framed foils.

 

Customers invest only in the frame, which comes complete with a footpedal to control the air supply during mounting, and the foils themselves.

 

Extruded aluminium edges and plastic corners add rigidity and streamline frame mounting and tensioning, making larger foils feasible.

 

DEK, dek.com

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FEINFOCUS Graphical User Interface (FGUI) software version 2.2 offers real-time background subtraction. Background subtraction reduces shading in x-ray imagery, a common problem in x-ray inspection that limits image contrast.

 

Shading appears as a slight fading of intensity from the image center toward the periphery, the degree of which depends largely on the sample or structure being x-rayed. The FGUI enables users to activate an automatic background subtraction process, loading a previously produced background image from one of the many buffers available. The gray values of the background image are automatically subtracted from those of the active x-ray image in real-time -optimizing image contrast and facilitating interpretation of the inspection results.

 

The inspection software has several new capabilities, including an AVI recorder, 16-bit image processing, seamless integration of Direct Digital Detectors (DDD) and image saving in a variety of formats (e.g. TIF, BMP and JPG). New image-processing operators have also been added, such as an electronic film operator.

 

FEINFOCUS, feinfocus.com

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Squeegees now available with the entire blade coated with Permalex. Reportedly reduces solder paste sticking. Infuses the blade with a polymer lubricant, developed through a multi-step metallurgical bonding process. Said to reduce stencil pulling and stretching, improving pad registration and stencil life.

 

Transition Automation Inc., transitionautomation.com

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Agilent Technologies' automated test solution for functional, at-speed test reduces the cost of testing high-speed, system-on-a-chip (SOC) devices. Part of the 93000 SOC Series, the high-speed I/O solution enables functional testing of high-pin-count devices, such as next-generation PC chipsets up to speeds of 3.6 Gb/s.

 

Enabled by the Pin Scale 3600 Digital Card, offers per-pin scalability from 800 Mb/s to 3.6 Gb/s. High-speed SOC devices are widely used in computer, digital consumer, communications and networking products.

 

Each pin offers both single-ended and differential I/O test capabilities to test a range of interfaces including DDR, G-DDR, PCI Express, S-ATA, HyperTransport and Front Side Bus (FSB). The automated test equipment can be matched to the device through software scaling, pin by pin.

 

Features a test processor per-pin architecture, which localizes all test processing, resulting in minimal measurement overhead and higher throughput. Delivers a differential pin edge placement accuracy (EPA) of better than ±30 ps.

 

With up to eight independent clock domains, can satisfy timing needs for concurrent at-speed testing of multiple buses running at non-friendly speed ratios (bus fractions).

 

Available in various data-rate, memory and pin-count configurations.

 

Agilent Technologies Inc., agilent.com

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