ECI 8000 E&C inks enable smart heating solutions for the smart home.

GoReflow-plus convection reflow soldering system has eight heating zones and active heated area of 2,980mm.

TR7700QE-S 3-D AOI inspects and detects defects in wire bonds, die bonds, SMD, bumps, wafer IC/chip, underfill, and solder joints.

Seho PlasmaFluxer uses cold-active plasma to melt micrometer-sized powder of adipic acid and deposit it on PCB.