Duluth, GA, January 2017 – Viscom today announced plans to exhibit at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif.

Visit Booth #3121 for demonstrations of Viscom’s complete lineup of 3D inspection systems for the electronics industry. The portfolio includes solder paste inspection (SPI), automatic optical inspection (AOI), and X-ray systems (AXI/MXI) with micro-computed tomography (µCT) for the highest defect coverage.

Viscom’s X7056 offers top-of-the-line 3D optical and simultaneous 3D X-ray inspection. With optical inspection resolution up to 8µm and X-ray inspection resolution from 5 to 20µm, shorter handling time and Viscom’s EasyPro user interface, this in-line system sets a new standard in quality assurance.

Additionally, the new 360View, showing best-in-class 3D AOI image quality, will be demonstrated on the S3088 ultra blue. The highly standardized and economic AOI system offers five camera views including 3D inspection. For electronics manufacturers, the S3088 ultra blue is the perfect solution to ensure that IPC standards are met. To meet the needs of all customers, (e.g. nine views and higher throughput) the models S3088 ultra, S3088 ultra gold and S3088 CCI are available and will be displayed at the show.

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