Technical paper provides new insight into low cycle fatigue life of solder joints in electronic packages with encapsulations
 
Beltsville, MD – February 7, 2017 – DfR Solutions, a leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that its technical paper, "Effect of Encapsulation Materials on Tensile Stress during Thermo-Mechanical Cycling of Pb-Free Solder Joints," will receive an Honorable Mention at the 2017 IPC APEX EXPO. Authored by DfR Solutions’ reliability experts Dr. Craig Hillman, Maxim Serebreni, Dr. Nathan Blattau, and Dr. Gilad Sharon, the paper explores the effect of polymer encapsulations on solder joints as it relates to reliability.

Electronic assemblies use a large variety of polymer materials to provide protection in harsh usage environments. However, variability in the mechanical properties effects the material selection process by introducing uncertainty to the long-term impacts on the reliability of the electronics. Typically, the main reliability issue is solder joint fatigue, which accounts for a large amount of failures in electronic components. This paper presents the effect of polymer encapsulations (such as coatings, pottings, and underfills) on the solder joints, which is necessary to understand when predicting reliability. “This paper reflects extremely well upon you and your company,” said IPC’s Technical Program Committee. “All of the papers considered were very well done, so you should feel extremely proud that the panel selected your paper as Honorable Mention.”
 
DfR Solutions is the creator of Sherlock Automated Design Analysis™ software, an innovative design reliability analysis tool that streamlines new product development by providing greater insights earlier, eliminating test failures due to design flaws, and accelerating product qualification. “Understanding the challenges facing electronics design is imperative for excelling in ever-evolving industries and technologies,” said DfR Solutions CEO Craig Hillman. “We are honored to receive this recognition from IPC and are proud to know that this paper helps further that understanding.”
 
In celebration of this achievement, the authors will receive individual certificates and will be acknowledged during the opening keynote ceremonies at the 2017 IPC APEX EXPO in San Diego, CA on Tuesday, February 15th, 2017 at 8:30 AM. IPC APEX EXPO is the premier event for the printed circuit board and electronics manufacturing industry. The 2017 expo will be held at the San Diego Convention Center located at 111 W Harbor Dr. in San Diego, CA on February 14-16, 2017. For more information about the event, visit www.ipcapexexpo.org.
 
​About DfR Solutions, LLC:
DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry. The company’s integrated use of Physics of Failure (PoF) and Best Practices provides crucial insights and solutions early in product design and development and throughout the product life cycle. DfR Solutions specializes in providing knowledge- and science-based solutions to maximize and accelerate the product integrity assurance activities of their clients in every marketplace for electronic technologies (consumer, industrial, automotive, medical, military, telecom, oil drilling, and throughout the electronic component and material supply chain). For more information regarding DfR Solutions, visit www.dfrsolutions.com.
 
About IPC
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its members, who are participants in the electronics industry. In pursuit of these objectives, IPC will devote resources to management improvement and technology enhancement programs, the creation of relevant standards, protection of the environment, and pertinent government relations. For more information about IPC, visit www.ipc.org.

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