ITASCA, IL — Kester is hosting a Technical Rework Seminar, scheduled to take place Tuesday, March 7 at Kester’s Global Headquarters in Itasca, IL.

The Technical Rework Seminar will cover Alternative Methods for BGA Rework Solder Paste and Flux Application; Rework Challenges for Leading Edge Components BGA, QFN and LED in Today’s Fast Moving Industry; Surface Insulation Resistance of No-Clean Flux Residue Under Various Surface Mount Component; Rework Flux - Application and Reliability; and Benchtop PCB Repair.

Kester’s Technology Manager, Denis Jean; Bob Wetterman from BEST; Paul Wood from Metcal; and Grant Price from Chemtronics will be presenting.

For more information or to RSVP for the seminar, contact Michelle O’Brien at mobrien@kester.com.

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