MADISON, AL — July 2017 — STI Electronics, Inc., a full service organization providing training services, training materials, analytical/failure analysis, prototyping, and small-to-medium volume contract PCB assembly, is pleased to announce the acquisition of a new Fischerscope X-ray XDAL 237 energy dispersive X-ray fluorescence (EDXRF) system.

The Fischerscope EDXRF measuring instrument has a silicon drift detector, allowing a higher resolution for light elements; Aluminum Al (13) to Uranium U (92). Not only can this system non-destructively measure various plating thicknesses on printed circuit boards and/or components, it also can measure and analyze very thin coatings (< 1 µm), complex compositions or small concentrations.

The measurements of the plating thickness include but are not limited to the following plating stack-up combinations:
•    Electroless Nickel / Immersion Gold (ENIG)
•    Gold / Palladium / Nickel / Copper
•    Immersion Tin / Copper
•    Immersion Silver / Copper
•    Tin-Lead / Copper

Mark McMeen, Vice President of Engineering Services, remarks: “This additional capability to perform non-destructive determination of the weight percentage of Pb (lead) and Sn (tin) in the plating accommodates the growing need for this type of testing. With both the SEM/EDS and the new EDXRF, STI’s Analytical Services Department can now better provide for customer demands.”

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