San Diego — July 2017 — KIC today announced plans to exhibit in Stand 1N55 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center.

The company will showcase the KIC ecosystem comprised of the brand new SPS Smart Profiler, RPI automatic profiling system, and the new Vantage with networked real-time dashboard.

This new reflow profiler transforms thermal process data collection from a costly chore to a value-added function. The core function of a reflow oven is to produce an acceptable profile on each PCB. The new KIC SPS smart profiler collects the profile data and compares it to the process specifications. Within seconds, the new smart profiler also suggests an improved reflow oven setup.

The new thermal profiler features a slick compact design made with an LCP (Liquid Crystal Polymer) enclosure for better heat protection & faster cool-down between profiles. It utilizes a rechargeable battery, profile stacking, Wi-Fi and Bluetooth for wireless data communication plus much more. This all-new smart thermal profiler design has been optimized for maximum thermal protection plus robust long-term operation.

Additionally, the KIC Vantage smart thermal process system will be demonstrated. The KIC Vantage is an ecosystem that automatically acquires and delivers insightful information in real-time to allow factories to produce consistent quality at lower costs with a higher level of automation. The software is retrofitable and can work in conjunction with KIC’s profilers and automatic systems.

For more information about KIC, visit www.kicthermal.com.

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