Kennesaw, Georgia, USA – Yamaha Motor Corporation, USA in partnership with Trans-Tec Worldwide, will exhibit dynamic new SMT assembly technology in booth #1023 at the upcoming SMTAI International Conference and Exhibition, September 19 & 20 at the Donald Stephens Convention Center in Rosemont, IL.

The equipment being shown will include the YSM20 Modular Mounter, the YSP printer, and YSiV software.

The Z:LEX YSM20 High-Efficiency Modular Mounter effectively accommodates a wide range of production processes while offering the world’s fastest placement performance in its class, 90,000 CPH / 63,500 CPH (IPC9850). It features large component handling capability, 03015mm to 55x100x28mm, large PCB handling up to L 810 x W 490 mm (dual stage, 1-board conveyor, single lane) or two boards up to L 810 x W 230 mm (dual lane). The YSM20 offers a maximum feeder count of 140 types. It features a high-speed head (10 nozzles) and a flexible multi-purpose head (5 nozzles) and is available in single or dual beam configurations.

The YSP is a high-speed, high-precision universal high-end printer featuring an 11 sec/cycle line-tact high-speed printing capability, and 6σ: +/- 12.5 um repeatability of positioning. It offers YAMAHA’s unique PSC system (Print Stability Control) and is equipped with the innovative 3S head (3S: Swing Single Squeegee) for variable attack angle printing.

Also on exhibit will be the user-friendly and intuitive YSi-V (AOI) inspection system software that makes the YSi-V not only an inspection tool but a process optimization enabler as well. YAMAHA will demonstrate the YSi-V via offline software.

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