Vass, NC – Aug 21, 2017 – PACE Worldwide will exhibit and demonstrate their new TF 1800 BGA Rework System, at the Capital SMTA Expo being held at the Johns Hopkins University Applied Physics Lab in Laurel MD this Thursday.

The TF 1800 incorporates a groundbreaking top-side inductive-convection heater, which provides rapid heat-up and active cooling of the solder joints, resulting in faster throughput and greater process control. The inductive-convection technology allows for an active cooling feature, which provides swift yet controlled component/PCB cool down, directly through the nozzle, yielding the highest quality joints. Its high efficiency, low thermal mass design takes far less power to operate and is more reliable than conventional heaters. An automated reflow head is driven by an advanced stepper motor, which provides smooth, high precision, repeatable movement, with no drift, allowing for soft landing of components and 30μm (0.0012”) placement accuracy. In addition, an advanced vacuum pick/shaft design is counterweight balanced to eliminate placement pressure on components, and uses precision high temperature linear ball bearings for highest sensitivity in placement & pick-up. PACE’s exclusive adjustable height bottom-side IR preheater allows safe, closer proximity to the PCB for the most challenging high thermal mass boards. Other features include: an HD vision overlay system for optical alignment with quad-field imaging capability for placement of outsized BGA’s or large fine-pitch QFP’s; an integrated underside board support to prevent sagging during reflow; and fourth generation software which guides operators through an intuitive interface that virtually automates the process. For more information, please visit our website at www.paceworldwide.com.

About PACE®

PACE Worldwide has been providing the most innovative, cost-effective solutions in hands-on soldering, rework and repair of advanced electronics to companies and government around the globe for well over 50 years. Since the dawn of the modern electronics industry, PACE has played a key role in the development of groundbreaking products, training films, curricula, materials and electronic assembly standards, including several soldering, surface mount and thru-hole rework videos co-produced with the IPC and industry.

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