Berlin, 25. August, 2017: Atotech, a world-wide leader in the field of chemicals and equipment for printed circuit board and package substrate manufacturing, will present its latest know-how on Pd initiation in the ENEPIG process at this year’s InterPACK 2017.

On Wednesday, August 30, from 9:15 to 10:45 am, Rick Nichols, Global Product Manager Surface Finish at Atotech Deutschland GmbH, will present the company’s latest study on Pd initiation in ENEPIG and its impact to solder joint reliability. In his presentation, Rick Nichols will demonstrate that the palladium initiation is crucial if maximum solder joint reliability (SJR) is to be achieved. Electrochemical and advanced optical techniques will be used to demonstrate that the SJR, in terms of High Speed Shear (HSS) testing, can be correlated to palladium initiation and associated Intermetallic Compound (IMC) formations.

InterPACK is the premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging, MEMS and NEMS, and the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). This year’s InterPACK will be held from August 29 to September 1, 2017, in San Francisco, USA.

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