Somerset, NJ – August 30th, 2017 – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be presenting information on its latest product innovations at a seminar hosted by ER-SA Elektrik, Alpha’s distributor partner for Turkey, in Aselsan, Turkey, on Monday the 11th of September.

Alpha’s latest technology developments including ALPHA® Sintering Technology, a range of products designed to meet the demanding quality standards of the power semiconductor and LED industry, will be discussed during the event. Alpha’s Sinter Technology products include ALPHA® Argomax® which has been specially designed for low pressure sintering die attachment.

“ALPHA® Argomax® in paste, film and preform technologies, provides high thermal and electrical conductivity silver bonds, high reliability and flexible bondline thickness,” explains Julien Joguet, Global Product Manager for Sintered Materials for Alpha Assembly Solutions, a MacDermid Performance Solutions business. “This addresses issues with die attach reliability in high volume manufacturing and challenging Si/SiC/GaN die attach processes.”

As well as advancements in sintering technologies, Alpha’s latest new cleanable, no-clean material, ALPHA® OM-347 solder paste, will be discussed at the seminar. The product has been designed to print and reflow Type 4 and Type 5 powder to meet market segments requiring ultra-fine feature applications. ALPHA® OM-347 has been tested to give excellent printing performance and an outstanding reflow process window.  After reflow, the resulting residue produced can be safely left on the board, or if needed, it can be very easily cleaned with a broad range of solvents.

To find out more about Alpha's latest product innovations please visit the Alpha Website. For more information on the ER-SA Elektrik seminar please contact Alpha’s Country Sales Manager for Turkey, Emine Ertug; Emine.Ertug@AlphaAssembly.com.

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