Lumberton, NJ – Formed from the merger of two powerhouse stencil manufacturers (FLS and MET); BlueRing Stencils will be highlighting advanced printing technologies at SMTA International in Rosemont, IL on September 19th-20th. In booth #905, BlueRing Stencils will have their broad portfolio of printing products and services on display, and will also take part in the technical conferences.

BlueRing’s Stencil Technology Manager, Greg Smith, will be part of the technical conference speaking on the topic; “Impact of Stencil Foil Type on Solder Paste Transfer Efficiency for Laser Cut SMT Stencils.” This paper will investigate laser cut wall quality on the different foils as well as the effectiveness of these foil types in relation to solder paste printing both with and without nano-coatings.  Results will be presented along with strengths and weaknesses of different foil types to aid the end user in making proper stencil choices.

In addition to BlueRing Stencils technical presentations, they will also be featuring their various products and services that were all developed to improve first pass yields and mitigate assembly defects. One of those technologies is the patented NanoSlic Gold Coated Stencil. The NanoSlic Gold Coated Stencil has quickly emerged as the premiere coating technology for improved solder paste transfer efficiency, reduced underside cleaning requirements and overall printing yield improvements.

BlueRing Stencils also offers board design and development through Root Cause Analysis and CAD-matic services. Their products and manufacturing methods undergo extensive research and development in their advanced SMT Printing Laboratory. For more information about all their other printing technologies and services, or to schedule an appointment, please contact Greg Starrett greg@blueringstencils.com.

PCB West, the Silicon Valley's largest PCB industry trade show, takes place next week. Register now at pcbwest.com! Now with full-day electronics assembly tutorials!

• Prev
• Next