Hardmeier Electronics, a major contract manufacturer in Switzerland, has replaced its complete surface-mount assembly line with the new Ultraflex line from ESSEMTEC. The line is capable of running larger batches in inline mode, but runs different boards simultaneously.

Hardmeier specializes in the assembly of small- to mid-size batches, so the new machines provide them with the possibility to run large series with high speed on some days, while on other days several small batches can be produced simultaneously.

The feeder concept with bar code scanning ensures placement quality and enables product changeovers while the machine is placing boards. The FLX1020-V holds up to 200 feeders and minimizes the need for feeder changes. Laser and vision centering gives customers the possibility to place nearly all available components from 0201s up to quad flat packs (QFPs), ball grid arrays (BGAs), microBGAs and connectors. The integrated software optimizes the feeder set up to eliminate unnecessary changeovers in production. The integrated dispensing system dispenses directly on the same line adhesives or solder paste for prototypes or smaller batches.

In combination with specialized loader/unloader systems, a FIFO Buffer, inspection conveyor and full convection oven for lead-free production, the installation is a fully automatic solution for low-to mid-size volumes.

www.hardmeier-electronics.ch

www.essemtec.com

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