Vectron Inc. (San Diego, CA), a provider of automated optical inspection (AOI) for semiconductor and electronics assembly, has announced the appointment of Joe Vilella, president and chief executive officer, as co-chairman of the IPC 7-32 Automated Inspection Technologies committee.
The industry subcommittee was formed to help surface-mount technology manufacturers deal with the present and future challenges posed by the continued trend of miniaturization in this industry through the proper application of state-of-the-art inspection technologies.
Vilella is responsible for the efforts to create up-to-date industry standards for the proper evaluation and implementation of AOI, automated x-ray inspection (AXI) and automated paste inspection (API) technologies to the surface-mount process. Amit Verma, who co-chairs the 7-32 subcommittee with Vilella, is responsible for the efforts to translate IPC-A-610 solder joint acceptance criteria into a language that is directly measurable by automated inspection machines through the correlation of data from AOI/AXI inspection methods to the reliability of lead-free solder joints via thermo-cycling. Both Vilella and Verma report to John Perry, who is the IPC staff liaison responsible for the oversight of this as well as several other committees related to the improvement of surface-mount methodologies and processes.
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