Milara Develops Wafer Printer/Bumper in One
Milara Inc. (Medfield, MA), a vendor of fully and semiautomatic stencil printers for surface-mount technology and wafer applications, has introduced STW-1, a wafer printer system.
Milara takes its combined system technology practice one step further with the development of the new SemiTouch Wafer Printer system. The system is capable of both wafer stencil printing and bumping within a single system. It is molded after Milara's standard printer but by pressing a single button, the system converts itself from a wafer bumper to stencil printer in seconds.
Milara has incorporated a new vision system with accuracies of 12 µm that yields capabilities of ultra-fine-pitch printing. Using patented vibration squeegee technology, which has proven viability in wafer bumping, the system uses the same technology to accomplish ultra-fine pitch-printing (down to 70 µm) with printing reliability (no missed apertures on wafers with excess of 25,000 per print) and solder brick geometry.
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