Universal Instruments Corp. (Binghamton, NY) and CyberOptics Corp. (Minneapolis, MN) have signed an agreement to integrate the new Embedded Process Verification (EPV) inspection technology from CyberOptics into Universal's electronic component placement systems.

Universal will offer the EPV sensor system as a feature on its recently released platform placement machines that incorporate its new placement head. Introduction of the sensor is currently planned for the second half of 2004.

Ian McEvoy, president of Universal, said, "To achieve the challenging quality goal of less than 10 defects per million for surface-mount circuit board assembly, you have to verify each component placement. The CyberOptics' EPV is the first sensing system to enable this within the placement machine."

Steven Case, CyberOptics' chairman and founder said, "Unlike traditional inspection systems that are positioned after the placement machine in an electronics assembly line, EPV puts the inspection process right at the point of action, inside the pick-and-place machine. Ultimately, defects detected by the EPV sensor may be corrected while the circuit board is still within the placement machine."

Universal Instruments is an electronics productivity specialist, providing circuit, semiconductor and back-end assembly technologies and equipment, integrated system solutions and process expertise to manufacturers in every sector of the electronics industry.

CyberOptics Corp., specializing in optical technology, designs and manufactures a growing range of yield and through-put enhancement tools for the surface-mount electronic assembly equipment and semiconductor fabrication equipment markets.

www.uic.com

www.cyberoptics.com

Copyright 2004, UP Media Group. All rights reserved.

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