[April 23, 2018 – Taipei, Taiwan] Test Research, Inc. (TRI) will feature its new generation of SPI, AOI, AXI and ICT inspection solutions at a technology seminar held in Penang, Malaysia.

The one-day event will focus on the latest technology innovations in TRI's comprehensive PCBA test and inspection portfolio, including the YMS 4.0 solution for Industry 4.0 smart manufacturing.

TRI's 2018 lineup features high performance CoaXPress upgrades to 3D AOI and 3D SPI solutions, the TR7500QE and TR7007D series. Also showcasing TR7700Q, TRI’s new cutting-edge inline 3D DFF AOI for high accuracy inspection and Multi-Core Parallel ICT series TR5001Q SII INLINE with a complete range of inline and standalone configurations.

Location Date Venue

Penang, Malaysia May 17, 2018 Eastin Hotel Penang

Discover how TRI's PCBA test and inspection solutions work together with Industry 4.0 data based YMS 4.0 management infrastructure to bring you maximum value in the production line and minimize production costs. TRI's systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load.

To register for the seminar, please contact your TRI sales representative.

About TRI

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), In-Circuit Tester (ICT) and Functional Tester (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, write us at marketing@tri.com.tw or call +886-2-2832 8918.

• Prev
• Next