Teaming with distributor partner Technica USA and electronics industry national distributor A-Tek Systems, ASM showcased its mid-speed market E by DEK printing platform and E by SIPLACE placement system during a two-day technology roadshow held in the A-Tek facilities in Longmont, Colorado. 

The unique design of the May 23 – 24 event offered attendees the chance to experience a factory-like set-up that included a full line configuration including material storage, contact cleaning, printing, solder paste inspection, placement, vapor phase reflow and automatic stencil cleaning.  Once visitors toured the line, they were able to hone in on specific processes and equipment demos for their particular application requirements. “The structure of this roadshow, where attendees book specific half-day time slots, allowed customers to get a broad equipment perspective, while also providing the opportunity to delve into various equipment capabilities one-on-one with technical specialists,” says Nick Crocker, ASM Americas Business Development Manager, E by SIPLACE and E by DEK.  “This event design attracted attendees from OEM and EMS companies with manufacturing requirements that spanned a variety of applications including aerospace, LED and industrial, among others.”

ASM showcased its E by DEK printer and E by SIPLACE placement machine, both offering world-class performance for mid-speed operations.  The latest in the line of ASM printing technologies, E by DEK is engineered to meet the challenges of manufacturers in the low/medium-volume, high-mix space with advanced printing technologies packaged in an exceptionally economical platform.   With an 11-second core cycle time and features such as HawkEye™ paste verification, Grid-Lok™ automatic board support and squeegee pressure feedback all controlled by award-winning Instinctiv™ software, E by DEK allows fast, precise and cost-effective printing of today’s miniaturized, high-density assemblies.  DEK VectorGuard™ stencils and DEK understencil cleaning chemistries and fabrics were also highlighted during the Colorado roadshow, illustrating the importance of high-quality process inputs for good print outcomes.

At the center of the roadshow demo assembly line was ASM’s E by SIPLACE system.  With a large, global installed base, E by SIPLACE has quickly emerged as the industry standard placement system for the mid-range market where multi-product, high-changeover requirements dictate the need for flexibility, simple operation, cost-consciousness and high-yield results.  Equipped with many of the next-generation capabilities of ASM’s high-volume equipment, E by SIPLACE features 100% digital vision inspection, powerful SIPLACE Pro software, placement head flexibility with adaptive pick-up, Smartfeeder E feeder technology and linear motors.  The combination of these capabilities allows manufacturers in the mid-speed sector to easily accommodate the realities of increasing product variation, NPI demands, build-to-order requirements and shorter planning cycles.

 “Together, E by DEK and E by SIPLACE deliver robust printing and placement capability, enabling mid-speed OEM and EMS firms to achieve ambitious production and cost objectives,” explains Crocker.  “Roadshow attendees appreciated being able to view these platforms alongside multiple SMT equipment systems and processes.”

For more information about E by SIPLACE, visit www.e-by-siplace.com.  Details regarding E by DEK are available online at www.e-by-dek.com. ASM’s next scheduled roadshow will take place in Southern California the week of August 20th.   To schedule an appointment, contact Nick Crocker by phone at 908-752-2596 or via e-mail at nick.crocker@asmpt.com.  

Register now for PCB WEST, the largest trade show for the printed circuit and electronics industry in the Silicon Valley! Coming Sept. 11-13 to the Santa Clara Convention Center.

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