[December 18, 2018 – San Jose, CA] Test Research, Inc. (TRI) will join IPC APEX EXPO 2019 held at San Diego Convention Center to showcase its Smart Factory inspection and test solutions for the printed circuit board electronics manufacturing industry. Visit TRI at booth #2533 on January 29 – January 31, 2019 to discover the newest innovations in 3D SPI, 3D AOI, 3D CT AXI and multicore ICT.

TRI is celebrating its 30th anniversary as the leading test and inspection solutions provider for the electronics manufacturing industry. TRI will proudly be displaying a commemorative 30th anniversary logo at IPC APEX EXPO 2019. TRI’s VP of Sales and Marketing, Jim Lin noted “We are grateful to our clients for the opportunities to provide them with solutions. We will continue providing innovative solutions as the leader in inspection and test in the SMT industry.”

TRI’s 2019 lineup features the industry’s leading 3D SPI TR7007QI, for accurate shadow-free solder inspection with digital fringe projectors and smart board warpage control. TRI will also exhibit the industry leading 3D AOI TR7500QE offering top and side camera multi-angle high-accuracy Inspection.

Also being showcased, TRI's new cutting-edge Inline 3D AOI TR7700Q with unprecedented 1um High-Resolution inspection capability. Discover TRI's world-class high-resolution and high speed 3D CT AXI TR7600F3D and TR7600 SIII. Finally complete your SMT Inspection and test tour with TRI's multi-core ICT TR5001Q SII Inline.

Visit us at IPC APEX EXPO 2019 booth #2533 for a personal demonstration of TRI's industry leading world-class test and inspection solutions lineup

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