San Diego — January 8, 2019 — KIC and Indium Corporation will hold a voiding clinic in Booth #1215 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31 at the San Diego Convention Center.

Two of the most effective ways to reduce voiding in solder joints is to analyze the assembly process from a materials perspective and from a reflow profiling perspective. Voiding experts from both KIC and Indium Corporation will be on hand to analyze customers’ soldering processes and recommend adjustments to help them to minimize their solder joint voiding.

Customers can drop by the KIC booth anytime between 1-3 p.m. Tuesday and Wednesday, Jan. 29-30. If those times are not convenient, they can email MB Allen at mballen@kicmail.com  to make an appointment.

Indium Corporation’s award-winning Indium8.9 No-Clean Pb-free Solder Paste has been proven to avoid the void by reducing voiding to as low as 10 percent. Together with KIC’s reflow profiling systems, customers can reduce overall voiding and improve the reliability of their end product.

KIC is a recognized leader in automated thermal process tools and systems for reflow, wave, curing and semiconductor thermal processes. The company pioneered the development of oven profilers and process optimization tools, and has created the next generation of thermal systems to help manufacturers improve thermal process quality and reduce costs.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

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