Pan Pacific Microelectronics Symposium

February 11-14, 2019

Kauai, Hawaii

Register here: https://www.smta.org/panpac/register_now.cfm

Several keynote speakers will present during the upcoming Pan Pacific Microelectronics Symposium this February. These thought-provoking presentations are sure to inspire you in your future technology decision-making.

2019 Pan Pac Keynote Presentations

New Era of Device Science

Jun Mizuno, Ph.D., Waseda University

11am-11:45am | Tuesday, February 12

Device science has become increasingly important along with the scaling and integration of electrical devices. Our laboratory focus on it from the viewpoint of Nano/Micro electro mechanical systems (NEMS/MEMS) filed. Keyword of our laboratory are nano/micro fabrication, electronics packaging, surface chemistry, modeling & simulation, and printed electronics. Based on these background, we are now focusing on "solid and liquid organic light-emitting diodes (OLEDs)," interconnection bonding, advanced materials, bio-MEMS devices. In this session, the hottest topics of our research (e.g. Bio analysis in microfluidic device, I-structure TGV, Film of Woody Carbon Materials, Self-cleaning glass, 5G-SAW device, Micro-channel TEM-grid, Advanced implants) will be presented.

What does my shirt tell me? The Integrating of Electronics in Clothing

Kaspar Jansen, Ph.D., Delft University of Technology

11am-11:45am | Wednesday, February 13

The era of smart textiles has begun. Sensors become smaller, more reliable and require less power and the market of garments for health monitoring increases exponentially. The challenges still are in the seamless integration, robustness and ease of use. In this presentation the developments and trends are discussed.

AI (Artificial Intelligence)-influenced Materials Science and the Design of Adhesives for Electronics

Bob Allen, IBM Corporation          

11am-11:45am | Thursday, February 14

For the past few decades, materials science and the development of materials for advanced technology was occasionally assisted by advanced computing. An example is the use of supercomputer simulation to provide predictive capabilities to block copolymer thin film directed self-assembly. Computer science is currently at an inflection point. Advances in data analytics, artificial intelligence, high performance computing and quantum computing are all occurring now. And it is our point of view that many of these advancements will impact the way we do discovery and development of new materials. This presentation will cover some of these advancements at a high level and show examples of how we are attempting to accelerate the development of new materials using high performance computing and AI.

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