TopLine Exhibits CCGA Solutions for Solder Joint Reliability at AeroTech in Tokyo
Irvine California, USA – TopLine will exhibit its innovative CCGA technology and other packaging solutions for at the upcoming Aerospace Technology & Components Expo (AeroTech), February 6 through 8, 2019 at Tokyo Big Sight in Japan. TopLine will exhibit its CCGA technology in Booth 38-32.
TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. For more information, and a quick chart of TopLine CCGA products, visit http://www.topline.tv/CCGA.html. For more information about CCGA, visit www.CCGA.co.
AeroTech is an exhibition gathering many different materials, components and technologies for aerospace manufacturing. AeroTech attracts aerospace manufacturing industry professionals from design, development, research, production engineering, purchasing and quality control departments. For more information about the show, visit https://www.japan-mfg.jp/en-gb/about/aerotech.html.
About TopLine
TopLine manufactures a wide range of Daisy Chain test components, Column Grid Arrays, Particle Impact Vibration Dampers and engineering evaluation kits for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers. For more information about TopLine, visit www.TopLine.tv.
