YINCAE offers over 130 different materials that are suited to a wide range of applications and processes.

They include several types of underfill, such as a 50% filler load underfill that can flow like water at room temperature and a zero outgassing underfill that is fully compatible with flux residue (eliminating the cleaning processes during manufacturing).

YINCAE is also an expert in solder joint encapsulants and encapsulant pastes. Both materials can enhance solder joint strength by 5 to 10x, and can be used at high temperatures (up to 300C) after low temperature soldering.

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