(Waterbury, CT USA) – April 4th, 2019 – Ansuman Das of MacDermid Alpha Electronics Solutions, the world leader in the production of electronic soldering and bonding materials, is presenting on Flux Cleaning from PCB Assembly: Challenges, Methods and Assessment on Wednesday 17th April, organized by SMTA India, Bangalore Chapter.

Although most PCB assemblies manufactured today involve a no-clean process, many applications still demand the flux residue to be removed after soldering due to more stringent electrical requirements.  In this SMTA webinar, Ansuman Das, R&D Manager of Soldering Products & Fluxes for MacDermid Alpha Electronics Solutions, will discuss the challenges facing assemblers today in terms of post-soldering flux cleaning and how to address with available methods.

“Change in design, materials and manufacturing processes involved in assembling has made the cleaning process more and more complex,” said Ansuman Das.  “It is important to understand the chemistry involved in the cleaning of different types of fluxes in different cleaning processes, as well as knowing the methods used to evaluate the cleanliness of the PCB assembly.”

The webinar will also cover the cleaning of paste fluxes and solder pastes in PCB assembly.  For additional information about MacDermid Alpha and their vast portfolio of soldering products, please visit alphaassembly.com.

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