Morgan Hill, California, USA – William (Bud) Crockett and Koyo Kobori of TANAKA Denshi will present papers at the upcoming IMAPS NE 46th Symposium & Expo on Tuesday May 7th, 2019 at theBoxboro Regency Hotel & Conference Center in Boxboro, Massachusetts, USA.

Bud Crockett’s presentation is titled “Alternative Cu Wires for High Reliability Applications” and Koyo Kobori’s presentation is “Hybrid Sintering Die Attach Material with Printing Process for Power Packages.” Both are in the morning “Interconnects” Session.

TANAKA will have a tabletop exhibit for the venue, in booth number #215. The sample display will include bonding wires, Ag paste(syringe) and plated solution(wafer). Technical specialists will be on hand to answer questions and discuss the applications.

For more information about the show and technical program, visit www.imapsne.org.

About TANAKA Denshi Kogyo

Tanaka Denshi Kogyo is a group company of TANAKA Precious Metals and has a global market share in the bonding wire market. Contact TANAKA America, Inc., 235 Vineyard Court, Suite 150, Morgan Hill, CA 95037, Tel 408.778.3217; www.TANAKAwire.com, or LinkedIn profile at https://www.linkedin.com/company/tanaka precious metals/ precious metals/

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