NORTH BILLERICA, MA, June 2019 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce that the new Pyramax Vacuum Reflow Oven has been installed at ACI Technologies’ showroom and demo center.

This is the second machine at ACI, the first was a Pyramax Convection Reflow Oven.

BTU’s Fred Dimock and Rob DiMatteo are currently on-site at ACI in Philadelphia conducting demonstrations on the vacuum reflow oven, which offers a sharp reduction in voiding in both BGAs and QFN components.

“There’s quite a bit of process development work going on in the industry for vacuum reflow applications,” said Fred Dimock, Manager of Process Technology, BTU. “We’re pleased we can team with ACI to offer not only our vacuum reflow oven, but the necessary metrology to characterize the experiments.”

To see a demonstration of the machine, please contact Mike Prestoy at mprestoy@aciusa.org or visit www.aciusa.org.

For more information about BTU International, visit www.btu.com.

About BTU International

BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, sintering and advanced solar cell processing. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.

Register now for PCB West, the leading conference and exhibition for printed circuit board design! Coming Sept. 9-12 to the Santa Clara Convention Center.  pcbwest.com

Read Fred Dimock's article, "Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data" in CIRCUITS ASSEMBLY this month.

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