Minneapolis, Minnesota — August 26, 2019 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will present at SEMICON Taiwan at the Taipei Nangang Exhibition Center on September 17 at 12:10pm. The company will also exhibit at the show in booth # L0310.

Tim Skunes, VP of R&D at CyberOptics, will present the technical paper ‘High precision sensing technology for semiconductor inspection and measurement applications.’ The semiconductor packaging industry continues to advance, with new designs adding more layers, finer features and more I/O channels for higher bandwidth and lower power consumption. In addition to the increased complexity, shiny and mirror-like surfaces present inspection challenges.

For wafer-level and advanced packaging inspection and measurement, CyberOptics will demonstrate the new proprietary NanoResolution Multi-Reflection Suppression (MRS) sensor technology that meticulously identifies and rejects multiple reflections caused by shiny components and mirror-like features. Effective suppression of multiple reflections is critical for highly accurate measurements.

Offering an unparalleled combination of high accuracy, high resolution and speed, MRS sensors are widely used for inspection and measurement in the SMT, semiconductor and metrology markets. The new 3-micron NanoResolution (X/Y resolution of 3 micron, Z resolution of 50 nanometer) MRS sensor enables metrology grade accuracy with superior 100% 3D and 2D measurement performance for features as small as 25-micron.

Further, it is two to three times faster than alternate solutions in the marketplace. With data processing speeds in excess of 75 million 3D points per second, the NanoResolution MRS sensor delivers throughput greater than 25 wafers (300mm) per hour. 100% 3D and 2D metrology and inspection can be completed simultaneously at high speed, versus an alternate, slow method that requires two separate scans for 2D and 3D, and only a sampling of a few dies of the 25 wafers.

This best-in-class MRS sensor technology is ideally suited for the inspection of solder balls and bumps, copper pillars, and other wafer-level and advanced packaging applications where high precision and speed are needed to improve yields, throughput and  process control.

For more information, visit www.cyberoptics.com.

About CyberOptics
CyberOptics Corporation (www.cyberoptics.com) is a leading global developer and manufacturer of high-precision 3D sensing technology solutions. CyberOptics’ sensors are used for inspection and metrology in the SMT and semiconductor capital equipment markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the Company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.

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