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[September 11, 2019 – Guadalajara, Mexico] Test Research, Inc. (TRI) will join SMTA Guadalajara 2019 to showcase its test solutions and inspection solutions for the SMT industry. Visit the TRI/SMT Integration Booth at Expo Guadalajara in booth #613 from October 23 - 24, 2019 to learn more about the latest innovations in 3D SPI, 3D AOI, 3D CT AXI, and multicore ICT.

TRI’s 2019 lineup features the industry-leading 3D AOI TR7500QE equipped with five cameras for multi-angle inspection, digital fringe pattern projectors and a 3D laser module for inspecting reflective surfaces. TRI will also feature the leading 3D SPI TR7007QI, for accurate shadow-free solder inspection with digital fringe projectors and smart board warpage control. TRI solutions are Smart Factory Ready, as they support the latest M2M Connection protocols, such as the IPC-Hermes-9852 standard.

TRI is celebrating its 30th anniversary as a leading test and inspection solutions provider for the electronics manufacturing industry. Join us at SMTA Guadalajara 2019 booth #613 for a personal demonstration of TRI's world-class test and inspection solutions lineup.

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