MULLICA HILL, NJ ― May 2020 ― Insituware LLC, the provider of the first smart insitu measurement solution with integrated machine learning technology, today announced that its Chief Scientist, Denis Barbini, Ph.D., will participate in a free Webinar hosted by the Dallas Chapter of the SMTA. The Webinar, “How do you ensure your solder paste is fit for use?” will take place Thursday, May 21, 2020 at 3 p.m. CST.

The Webinar will discuss how the miniaturization of components has caused increased defects in the Surface Mount Technology (SMT) process during solder paste printing. The root cause of solder paste printing failures is often attributed to the stencil, squeegee or printing process parameters; however, the solder paste is often overlooked and could be the cause of printing and soldering defects.

Although there are current methods for quality control of solder pastes such as rheological techniques, they are not commonly used because of their complexity and high costs. Therefore, there is a need to implement a more affordable and efficient tool to control the solder paste before and during its use in order to reduce printing failures and minimize variations in the SMT process.

Dr. Denis Barbini is an experienced General Director with a demonstrated history of working in the electrical and electronic manufacturing industry. He is skilled in DMAIC, Value Stream Mapping, Failure Mode and Effects Analysis (FMEA), Quality Management, and Root Cause Analysis, and a strong sales professional with a Ph.D. focused in Chemistry, Material Science from State University of New York at Binghamton.

For more information or to register for the Webinar, visit https://www.smta.org/webinars/#solder-paste. To learn more about Insituware, visit www.insituware.com.

• Prev
• Next