OSAKA, JAPAN — December 2020 — Nihon Superior Co. Ltd., an advanced joining material supplier, is pleased to announce that Keith Sweatman, Senior Technical Advisor, will participate in a panel discussion on Tuesday, Dec. 8, 2020 at 7:30 a.m. PCT / 10:30 a.m. EST / 3:30 p.m. GMT / 4:30 p.m. CET. The panel discussion is entitled “Low temperature solders – revisited.”

Following the highly successful panel discussion in June, this panel will revisit this topic to learn more about some of the latest techniques, materials and processes to meet the challenge of working with low-temp solders. To register, visit  https://us02web.zoom.us/webinar/register/WN_uT6QdlrkQAC0eaBZ13MIeQ.

Sweatman is a graduate in metallurgical engineering who has been involved in the solder industry and soldering technology for more than 45 years. He has been an active participant in several HDPUG and iNEMI consortia projects relating to lead-free solder performance and reliability and is a regular speaker at IPC and SMTA conferences.

Nihon Superior continues to offer solutions to the challenges facing the electronics industry, such as improvements in reliability, thermally stable joining, and lead-free die attach. For more information about Nihon Superior’s new flux-cored wire, solder pastes and lead-free products, visit www.nihonsuperior.co.jp/english.

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