February 24 2021 - Haverhill, MA, USA - Circuit Technology Center is frequently tasked with the selective rework of BGA devices that have been underfilled with “non-reworkable” underfill epoxy.

Traditional, established rework methods of using either hot gas or IR reflow technology cannot be used when non-reworkable underfills have been injected under BGAs.  Circuit Technology Center developed a reliable process to solve this challenging application and provided details in a new guidebook procedure.

For more information see the guidebook procedure at:  https://www.circuitrework.com/guides/9-5-1.html

PCB EAST: The original East Coast technical conference and exhibition! Returning to the Boston suburbs in June 2021!

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