Void-free soldering with the Condenso for safe solder joints

For the first time after 2019, AMPER in Brno can now open its doors again. With well over 500 exhibitors, this trade fair for the Eastern European electronics industry continues to be an important meeting place for professionals from research and practice. registered for AMPER 2022. As an established manufacturer of reflow soldering systems, Rehm has continued to expand in recent years and also offers innovative solutions for convection and condensation soldering with and without vacuum as well as for conformal coating processes in the field of protective coating in this region.

AMPER in Brno, Czech Republic, has become one of the largest trade events for the electronics industry in Europe. Rehm Thermal Systems is exhibiting again this year and will be presenting a CondensoXC Vac for condensation soldering, among other things, there from May 17 to 20, 2022 in Hall F, Stand 2.15. This space-saving yet powerful batch system is the ideal choice especially for low throughput and is mostly used in laboratory applications, small batch production or prototyping. For optimal and virtually void-free soldering results, this system is available with a vacuum option.

With the closed-loop system for the injected medium Galden integrated in the vapor phase soldering systems of the Condenso series, Rehm has used a future-proof, sustainable solution right from the start. Due to the hermetic sealing of the process chamber (simultaneously vacuum chamber), the "evaporation loss" of the Galden® during soldering is also excluded. In addition to minimal maintenance, operating costs are also reduced due to lower medium consumption.

A sustainable solution for economical vapor phase soldering.

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